Details

Advanced Thermal Management Materials


Advanced Thermal Management Materials



von: Guosheng Jiang, Liyong Diao, Ken Kuang

117,69 €

Verlag: Springer
Format: PDF
Veröffentl.: 13.09.2012
ISBN/EAN: 9781461419631
Sprache: englisch
Anzahl Seiten: 156

Dieses eBook enthält ein Wasserzeichen.

Beschreibungen

<i>Advanced Thermal Management Materials</i> provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions.
<p>Introduction to Thermal Management in Microelectronics Packaging.- Requirements of Thermal Management Materials.- Overview of Traditional Thermal Management Materials.-Development of Advanced Thermal Management Materials.- Properties of WCu, MoCu, Cu/MoCu/Cu High Performance Heat Sink Materials and Manufacturing Technologies.- Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications.- &#xa0;Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications.- Al/SiC Thermal Management Materials.- Understanding of Laser, Laser diodes, Laser diode packaging and its relationship to Tungsten Copper.- Future Trend of Advanced Thermal Management Materials.</p>
<p>Provides an in-depth overview of copper, metal and aluminum materials and discusses the advantages and disadvantages of each in thermal management</p>
<p>Discusses numerical simulation methods and techniques used in analysis of electronic devices and materials</p>
<p>Covers system and component integration of advanced packaging materials</p>

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